Depth profile study on Ti/Al bilayer Ohmic contacts to AlGaN/GaN
 
Yazarlar (2)
Doç. Dr. Abdullah AKKAYA Kırşehir Ahi Evran Üniversitesi, Türkiye
Enise Ayyildiz Erciyes Üniversitesi, Türkiye
Makale Türü Özgün Makale (SCOPUS dergilerinde yayınlanan tam makale)
Dergi Adı MATERIALS TODAY-PROCEEDINGS
Dergi ISSN 2214-7853
Dergi Tarandığı Indeksler Scopus, Conference Proceedings Citation Index, INSPEC
Makale Dili Türkçe Basım Tarihi 01-2021
Kabul Tarihi Yayınlanma Tarihi 01-01-2021
Cilt / Sayı / Sayfa 46 / 1 / 6939–6946 DOI 10.1016/j.matpr.2021.03.268
Makale Linki https://linkinghub.elsevier.com/retrieve/pii/S221478532102318X
Özet
The electrical performance of double layered Ohmic contacts not only depends on layer thicknesses, annealing temperatures and annealing time etc. but also Ohmic contact metals and reactions with substrates and each other. Furthermore, oxidation tendency of Ohmic contact metals is highly important for contact quality and stability. In this study, we have investigated Ti/Al Ohmic contact formation on undoped AlGaN substrates by X-ray photoelectron spectroscopy (XPS) depth profile analysis. We aimed to reveal the oxide compounds and reaction products of metals and dependencies to the contact depth. In survey mode and depth profile mode five atoms core level (Ga 3d, Al 2p, N 1 s, Ti 2p and O 1 s) was observed and the XPS core level peaks were convoluted with Gaussian profiles to identify the origin of the peaks. Our results show that Ohmic contact metals strongly incorporated with oxygen, leading to high …
Anahtar Kelimeler
TLM | XPS | Depth profile | Ohmic contact | TiAl3 metallic alloy