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Dependency of Eutectic Spacing and Microhardenss on Directions and Magnitudes of UniformElectrical Field in the Al-Cu Eutectic Alloy   
Yazarlar (4)
Dr. Öğr. Üyesi Sercan BASİT Dr. Öğr. Üyesi Sercan BASİT
Kırşehir Ahi Evran Üniversitesi, Türkiye
Mahmut Erol
Yıldız Teknik Üniversitesi, Türkiye
Yahya Bayrak
Yıldız Teknik Üniversitesi, Türkiye
Necmettin Maraşlı
Yıldız Teknik Üniversitesi, Türkiye
Devamını Göster
Özet
In present study, the effect of uniform electric field on microstructure and hardness of Al-33wt.% Cu eutectic alloy were investigated. For this purpose, an apparatus was designed to directionally solidify the Al-Cu eutectic alloy under different directions and magnitudes of high uniform electrical fields, obtained by applying high positive and negative voltages up to DC 6 kV between two parallel copper plates.Firstly, the Al-Cu molten eutectic alloy at near the eutectic composition was solidified with none uniform electrical fields under certain solidification conditions and then, the same alloy were solidified under the same solidification conditions with different directions and magnitudes of uniform electrical fields. The eutectic spacing and hardness of the Al-Cu eutectic alloy, solidified both without and with uniform electrical fields were measured and dependency of eutectic spacing and hardness on directions and …
Anahtar Kelimeler
Bildiri Türü Tebliğ/Bildiri
Bildiri Alt Türü Tam Metin Olarak Yayınlanan Tebliğ (Uluslararası Kongre/Sempozyum)
Bildiri Niteliği Alanında Hakemli Uluslararası Kongre/Sempozyum
Bildiri Dili İngilizce
Kongre Adı 19th InterationalMetallurgy and MaterialsCongress
Kongre Tarihi 25-10-2018 / 27-10-2018
Basıldığı Ülke
Basıldığı Şehir
BM Sürdürülebilir Kalkınma Amaçları
Atıf Sayıları

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