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Electro growth of Al-Cu eutectic alloy       
Yazarlar
Dr. Öğr. Üyesi Sercan BASİT Dr. Öğr. Üyesi Sercan BASİT
Kırşehir Ahi Evran Üniversitesi, Türkiye
Semih Birinci
Necmettin Maraşlı
Yıldız Teknik Üniversitesi, Türkiye
Özet
The effects of directions and magnitudes of static electrical field on solidification of Al-33 wt.%Cu eutectic alloy were investigated. For this purpose, a new directional solidification apparatus was specially designed to solidify the Al-Cu eutectic alloy under static high electrical field (E). For the first time, the Al-Cu molten eutectic alloy was solidified under different directions; parallel and antiparallel of the solid liquid interface growth direction (E+ and E_, respectively) and magnitudes (7-10 kV/cm) of static high electrical fields. The lamellar spacing (lambda), eutectic grain size (EGS) and hardness (HB) of the Al-Cu eutectic alloy solidified with different values of E+, and E_ were measured with standards methods. It was observed that the static electrical field is an effective control parameter on the directional solidification and the values of lambda, EGS and HB are increased and decreased with increasing the values of E+ and E_, respectively in the Al-Cu eutectic alloy. Finally, the dependency of EGS and HB values on E+ and E_ values were obtained with linear regression analysis in the Al-Cu eutectic alloy.
Anahtar Kelimeler
Aluminium‑copper alloy | Grain size | Hardness | Microstructure | Solidification under electric field
Makale Türü Özgün Makale
Makale Alt Türü SSCI, AHCI, SCI, SCI-Exp dergilerinde yayımlanan tam makale
Dergi Adı MATERIALS CHARACTERIZATION
Dergi ISSN 1044-5803
Dergi Tarandığı Indeksler SCI
Makale Dili İngilizce
Basım Tarihi 03-2020
Cilt No 161
Sayı 1
Doi Numarası 10.1016/j.matchar.2020.110157
Makale Linki https://www.sciencedirect.com/science/article/abs/pii/S1044580319323605?via%3Dihub
BM Sürdürülebilir Kalkınma Amaçları
Atıf Sayıları
WoS 4
SCOPUS 4
Google Scholar 4
Electro growth of Al-Cu eutectic alloy

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